Title:
【発明の名称】プリント配線板の実装表面へ実装するための圧力センサ装置
Document Type and Number:
Japanese Patent JP2000513447
Kind Code:
A
Abstract:
A pressure sensor for mounting on the components side (2) of a printed circuit board (3) has a chip-carrier (5) made of electro-insulating material and having an approximately flat chip-carrying surface (4) to which a semiconductor chip (6) with a pressure sensor is secured, and electrode terminals (7) which extend through the chip-carrier (5) and are electrically connected to the semiconductor chip (6). The chip-carrier (5) is open at the side (22) opposite to the components side (2) of the printed circuit board and has at its edges (24, 25) that delimit the opening (23) supporting means (26) that form-fittingly and mechanically engage, without play, holding means (27) for an adapter (28) that can be set on the chip-carrier (5), so that when the adapter (28) is set on the chip-carrier (5) the holding means (27) and the supporting means (26) engage each other.
Inventors:
Jürgen Winterler
Gottfried Behr
Gottfried Behr
Application Number:
JP50374698A
Publication Date:
October 10, 2000
Filing Date:
June 27, 1997
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
G01L9/00; G01L19/00; H01L29/84; (IPC1-7): G01L9/00; G01L19/00; H01L29/84
Domestic Patent References:
| JPH04309831A | 1992-11-02 | |||
| JPH07146195A | 1995-06-06 | |||
| JPH07218364A | 1995-08-18 | |||
| JPH07113706A | 1995-05-02 | |||
| JPH01114731A | 1989-05-08 | |||
| JPS61247933A | 1986-11-05 | |||
| JPS6327724A | 1988-02-05 |
Attorney, Agent or Firm:
Toshio Yano (3 outside)