Title:
【発明の名称】ケーブル半導体層を変更する方法
Document Type and Number:
Japanese Patent JP2000516439
Kind Code:
A
Abstract:
A method of altering a portion of the semiconductive layer of an electric power cable, to increase its resistance so as to render it electrically insulative. The semiconductive layer is loaded with carbon powder which forms chains to provide conductive pathways through the layer. By introducing an intercalant into the semiconductive layer, which causes the layer to swell, the conductive pathways are interrupted and the material is rendered insulative (>104 OMEGA -cm). The intercalant may be a polymerizable material with a curing agent which is cured in situ, i.e., without removing the semiconductive layer from the cable. By this method, flashover to the semiconductive layer at a cable splice or termination may be prevented without requiring tedious removal of the exposed portion of the semiconductive layer. The method is usable with both strippable and coextruded semiconductive layers.
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Inventors:
Shreve, Gary A.
Somasiri, Nanyakkala Ryanage Don
Mooney, Justin Ann
Harum-Lowe, Alan George
Gilbert, Curtis Roy
Somasiri, Nanyakkala Ryanage Don
Mooney, Justin Ann
Harum-Lowe, Alan George
Gilbert, Curtis Roy
Application Number:
JP50788398A
Publication Date:
December 05, 2000
Filing Date:
November 21, 1996
Export Citation:
Assignee:
Minnesota Mining and Manufacturing Company
International Classes:
H02G1/14; H02G15/02; H02G15/064; H02G15/068; H01B13/00; H02G15/103; H02G15/184; H02G15/188; (IPC1-7): H02G1/14; H01B13/00; H02G15/02
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)