Title:
【発明の名称】弾力性バンプの製法
Document Type and Number:
Japanese Patent JP2001506196
Kind Code:
A
Abstract:
This invention relates to a manufacturing process for making elastic bumps in the micro-electronic field. It solves the problem to mould micrometer sized elastic features by means of a micro-machined mould. The method is a reproducible moulding technology to achieve elastic bumps being a perfect replication of the mould. The mould is made of one or several grooves etched in a silicon wafer. The method includes the steps of: cleaning the surface of the mould (100) from dust and other particles; depositing a release agent on the mould and the release agent, e.g. Parylene or silane, forming a conformal self-assembled layer (118) on the surface of the mould; putting on a curable elastomer, to form an elastomeric structure (208) on the mould; curing the mould and the structure; and separating the structure from the mould.
Inventors:
Hesselbom, Lillebroll, Fujalmar
Bodo, Yang, Peter
Bodo, Yang, Peter
Application Number:
JP52762898A
Publication Date:
May 15, 2001
Filing Date:
December 19, 1997
Export Citation:
Assignee:
Telefon Acty Boraget Elm Ericson (Pubble)
International Classes:
B29C33/38; B29C33/42; B29C33/58; B29C33/62; B29C33/64; (IPC1-7): B29C33/58
Attorney, Agent or Firm:
Akira Asamura (3 outside)