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Patent Searching and Data


Title:
【発明の名称】ヒートシール可能なフィルム
Document Type and Number:
Japanese Patent JP2001512384
Kind Code:
A
Abstract:
A film having a polypropylene surface layer and a polyethylene surface layer is used in fill and seal packaging applications, in which the polyethylene layer consists essentially of a ethylene copolymer having a narrow molecular weight distribution ethylene and a CBDI of greater than 50%. The package is formed by heat sealing the polyethylene surface to the polypropylene surface of the film to form a transverse seal.

Inventors:
Van Rune, Akiel Josphesus Maria
Donald Fiona
Espiel, Patrick
Application Number:
JP53698798A
Publication Date:
August 21, 2001
Filing Date:
February 24, 1998
Export Citation:
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Assignee:
ExxonMobil Chemical Patents, Inc.
International Classes:
B32B27/32; C08J5/18; C08K5/20; C08L23/04; C08L23/08; C08L23/10; (IPC1-7): B32B27/32; C08J5/18; C08L23/04; C08L23/10
Attorney, Agent or Firm:
Yuzo Yamazaki (2 outside)