Title:
【発明の名称】3本の円柱に取り付けられるプラットホームアセンブリを含む研磨装置
Document Type and Number:
Japanese Patent JP2001517559
Kind Code:
A
Abstract:
A polishing machine includes a platform assembly mounted within three support columns. The platform assembly includes fluidically pressurized bladders for urging the upper polish plate toward and away from the lower polish plate. In one embodiment a movable support column is suspended from an overlying frame. The support column is engaged with the upper polish plate so as to selectively raise and lower the platform assembly. In another embodiment, the platform is raised and lowered by threaded shafts so as to engage and thereby displace the upper polish plate.
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Inventors:
Anderson, Robert, Elle.
Manseaux, Michael.
Delza, Journus, Alexander.
Bussin, John, Edward.
Manseaux, Michael.
Delza, Journus, Alexander.
Bussin, John, Edward.
Application Number:
JP2000512667A
Publication Date:
October 09, 2001
Filing Date:
August 28, 1998
Export Citation:
Assignee:
Speedfam-I.I.C. Corporation
International Classes:
B24B7/17; B24B7/22; B24B41/02; B24B37/08; (IPC1-7): B24B7/17; B24B41/02
Attorney, Agent or Firm:
Takakazu Tsukahara