Title:
【発明の名称】基板クランプ装置
Document Type and Number:
Japanese Patent JP2001517562
Kind Code:
A
Abstract:
The present invention generally provides a robot that can transfer two workpieces, such as silicon wafers, simultaneously and at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two clamp fingers connected to a single flexure member to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except near fall extension of the workpiece handling member to deliver or pick up a wafer.
Inventors:
Ebbing, Peter, F.
Thunder, Satish
Thunder, Satish
Application Number:
JP2000513311A
Publication Date:
October 09, 2001
Filing Date:
August 19, 1998
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
B65G49/07; B25J15/08; H01L21/673; H01L21/677; H01L21/687; (IPC1-7): B25J15/08; B65G49/07; H01L21/68
Attorney, Agent or Firm:
Yoshiki Hasegawa (2 outside)