Title:
【発明の名称】正確な輪郭を有する幾何学的金属構造体製造のためのはんだペースト
Document Type and Number:
Japanese Patent JP2001518849
Kind Code:
A
Abstract:
A process for producing, on a metallic substrate, a geometric metal structure having a precise contour, including the steps of: solder coating a solder paste onto the substrate by screen printing to create the geometric metal structure, the solder paste comprising an organic binder system, and 80 to 95 weight % of a mixture of a nickel-based solder and a pulverulent alloy of nickel with at least one member selected from the group consisting of chromium, molybdenum, tungsten, manganese and iron, provided as a higher-melting metallic filler, wherein a weight ratio of solder to filler is 2-6:1, an average grain size of the solder is between 10 and 50 mum, and a grain size ratio of solder to filler, relative to the average grain size is from 0.5-2.5:1; drying the structure; decomposing the organic binder system present in the solder paste, without leaving a reside, by a heat treatment; and raising the temperature until the resulting solder material liquifies.
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Inventors:
Jurgen Koch
Manfred Koschlich
Halalto crappits
Wolfgang Weber
Claus René
Klaus Schmidt
Manfred Koschlich
Halalto crappits
Wolfgang Weber
Claus René
Klaus Schmidt
Application Number:
JP54483698A
Publication Date:
October 16, 2001
Filing Date:
March 17, 1998
Export Citation:
Assignee:
Degussa-Hüls Akchen Gesell Shaft
Federal-Mogar Sealing Systems Gesellschaft Mitt Beschlenktel Haftung
Federal-Mogar Sealing Systems Gesellschaft Mitt Beschlenktel Haftung
International Classes:
B23K1/20; B23K35/02; B23K35/14; B23K35/22; B23K35/30; B23K35/363; (IPC1-7): B23K35/22; B23K1/20; B23K35/30; B23K35/363
Attorney, Agent or Firm:
Toshio Yano (3 outside)