Title:
【発明の名称】モールドポリマー複合材加熱器
Document Type and Number:
Japanese Patent JP2001519592
Kind Code:
A
Abstract:
A molded polymer composite heater is shown. The use of transfer molding and compression molding allows for the use of thermoset polymers containing very high levels of reinforcement fillers. These improved materials, in turn create a heater with thermophysical properties superior to the prior art, including higher heat flux levels, thermal conductivity, impact resistance, and maintenance of mechanical properties at high temperatures (~>300° F.). The present invention also allows for wide variety of geometric configurations and the possibility to insert temperature sensors directly in hot zones of the heater.
Inventors:
Steinhauser, Lewis, Pee
Jutner, A, Conrad
Jutner, A, Conrad
Application Number:
JP2000515412A
Publication Date:
October 23, 2001
Filing Date:
October 05, 1998
Export Citation:
Assignee:
Watlow Electric Manufacturing Company
International Classes:
H05B1/02; H05B3/18; H05B3/46; H05B3/48; H05B3/78; (IPC1-7): H05B3/78; H05B3/18; H05B3/48
Attorney, Agent or Firm:
Akira Asamura (3 outside)