Title:
【発明の名称】フレキシブルなサポートを備えたプリント回路アセンブリ
Document Type and Number:
Japanese Patent JP2001527698
Kind Code:
A
Abstract:
The printed circuit board (10) is manufactured on the basis of a flexible support (11) on which, and by conventional procedures, is adhered a coat of conductive material (12), formed by tracks (13), by the aplication by any known method of an adhesive (14) specially able to whitstand temperature, in order to avoid it's effect on the adhesive which has to whitstand strains due to folding and, in certain cases, to torsion since the conductive coat (12) to fold may be up to 800 micron thick, without the appereance of the effect named delamination, i. e. the separation of (12) and (11) due to lack of adherence between both layers.
Inventors:
Fernandez, Salvador Gomez
Application Number:
JP53306698A
Publication Date:
December 25, 2001
Filing Date:
January 29, 1998
Export Citation:
Assignee:
Rear Automotive Dearborn, Inc.
Mechanismos Ausiliares Industrialless S.A.
Mechanismos Ausiliares Industrialless S.A.
International Classes:
H05K1/00; H05K1/02; H05K3/38; (IPC1-7): H05K1/02
Attorney, Agent or Firm:
Takehiko Suzue (4 outside)