Title:
【発明の名称】電力送達システムをテストするための改良型の電力コンタクト
Document Type and Number:
Japanese Patent JP2002501280
Kind Code:
A
Abstract:
An improved test system comprises a printed circuit board (13) and a tested assembly wherein the printed circuit board (13) has a plastic chassis encompassing one surface and a set of power pads (33, 35) may be coupled to conductors on the one surface of the printed circuit board (13) and a second surface of the set of power pads (33, 35) is available for electrical coupling through an opening in the plastic chassis. The test assembly vertically pushes down on the printed circuit board until the second surface of the set of power pads contacts a power source, thus electrically coupling the printed circuit board to the power source (15).
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Inventors:
Ayers, david jay
Brownell, michael
Brownell, michael
Application Number:
JP2000527868A
Publication Date:
January 15, 2002
Filing Date:
January 05, 1999
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
G01R1/073; G01R31/50; G06F1/00; H01R12/18; H05K3/00; G06F; (IPC1-7): H01R12/18; G01R31/02; H05K3/00
Attorney, Agent or Firm:
Masaki Yamakawa