Title:
【発明の名称】固体触媒を含むCMPスラリー
Document Type and Number:
Japanese Patent JP2002516378
Kind Code:
A
Abstract:
A chemical mechanical polishing composition comprising an oxidizing agent and at least one solid catalyst, the composition being useful when combined with an abrasive or with an abrasive pad to remove multiple metal layers from a substrate.
Inventors:
One, Shumin
Mueller, Brian El.
Mueller, Brian El.
Application Number:
JP2000550932A
Publication Date:
June 04, 2002
Filing Date:
May 25, 1999
Export Citation:
Assignee:
Cabot Microelectronics Corporation
International Classes:
B24B37/11; C09G1/02; C09K3/14; C23F3/00; H01L21/321; (IPC1-7): C09K3/14; C09G1/02; C23F3/00
Attorney, Agent or Firm:
Takashi Ishida (4 others)