Title:
【発明の名称】化学蒸着のための有機銅前駆体
Document Type and Number:
Japanese Patent JP2002522453
Kind Code:
A
Abstract:
The present invention provides a copper precursor according to the formula (R3COOCR2COR1)Cu+1{L}x, where x is 1, 2 or 3 and L is a neutral ligand. The precursors in the present invention, which are low melting solids or distillable liquids with high volatility and thermal stability, can be vaporized without decomposition and used to deposit high quality copper films. The improved stability of the copper compounds in the present invention enables them to reproducibly produce selective copper films on metallic or electrically conductive surfaces.
Inventors:
Choi Hyunso
Application Number:
JP2000563846A
Publication Date:
July 23, 2002
Filing Date:
August 06, 1999
Export Citation:
Assignee:
Choi Hyunso
International Classes:
C07C49/92; C07F1/00; C07F1/08; C07F7/08; C07F9/142; C23C16/18; H01L21/28; H01L21/285; (IPC1-7): C07C49/92; C23C16/18; H01L21/285
Attorney, Agent or Firm:
Shimizu Hatsushi (1 person outside)