Title:
【発明の名称】動作周波数を有するマイクロメカニカル共振器を含むデバイス及び動作周波数を拡張する方法
Document Type and Number:
Japanese Patent JP2002535865
Kind Code:
A
Abstract:
A flexural-mode, micromechanical resonator utilizing a non-intrusive support structure to achieve measured Q's as high as 8,400 at VHF frequencies from 30-90 MHz is manufactured using polysilicon surface micromachining technology. Also, a method for extending the operating frequency of the resonator as well as other types of micromechanical resonators is disclosed. One embodiment of the method is called a differential-signaling technique. The other embodiment of the method is called a dimple-down technique. The support structure includes one or more torsional-mode support springs in the form of beams that effectively isolate a resonator beam from its anchors via quarter-wavelength impedance transformations, minimizing anchor dissipation and allowing the resonator to achieve high Q with high stiffness in the VHF frequency range. The resonator also includes one or more spacers in the form of dimples formed on the flexural resonator beam or the substrate. In operation, the dimples determine a capacitive-transducer gap of the resonator. When a large DC-bias voltage is applied between a drive electrode and the resonator beam, the dimples provide a predetermined minimum distance between the flexural resonator beam and the drive electrode.
Inventors:
Guyen Clark Tea-Sea
McCork O'Dale Michael
Wankun
McCork O'Dale Michael
Wankun
Application Number:
JP2000594196A
Publication Date:
October 22, 2002
Filing Date:
January 14, 2000
Export Citation:
Assignee:
The Regents of the University of Michigan
International Classes:
H03H3/007; H03H9/24; H03H9/46; H01H59/00; (IPC1-7): H03H9/24
Attorney, Agent or Firm:
Minoru Nakamura (9 outside)