Title:
【発明の名称】薄膜メタライゼーション用基板の表面処理
Document Type and Number:
Japanese Patent JP2003507573
Kind Code:
A
Abstract:
A substrate is prepared for thin film metallization by applying one or more substantially conformal films or layers of a silicon glass onto the surface of the substrate. The total thickness of the glass on the substrate is not more than approximately 12,000 to 15,000 Angstroms and preferably between about 4000 and 6000 Angstroms. The glass is preferably deposited substantially uniformly onto the substrate surface so that the topographical features of the underlying substrate are not significantly changed by the presence of the glass.
Inventors:
Briggs, Kimberly, Earl.
La Mare, Robert, J.
Soran, Paul, Tee.
La Mare, Robert, J.
Soran, Paul, Tee.
Application Number:
JP2001516958A
Publication Date:
February 25, 2003
Filing Date:
August 03, 2000
Export Citation:
Assignee:
Mini-Systems, Inc.
International Classes:
C04B41/87; C04B41/91; C23C14/02; C23C16/40; H05K1/03; H05K3/38; (IPC1-7): C23C16/40; C04B41/87; C04B41/91; H05K1/03
Attorney, Agent or Firm:
Masao Okabe (10 outside)