Title:
【発明の名称】化学的-機械的平坦化に使用される調整およびモニターのための装置および方法
Document Type and Number:
Japanese Patent JP2003508904
Kind Code:
A
Abstract:
A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.
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Inventors:
Moore, Scott E.
Application Number:
JP2001520262A
Publication Date:
March 04, 2003
Filing Date:
August 31, 2000
Export Citation:
Assignee:
MICRON TECHNOLOGY,INC.
International Classes:
B24B49/00; B24B49/16; B24B53/00; B24B53/007; B24B53/017; B24B53/12; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; B24B53/00; B24B53/02
Domestic Patent References:
| JPH10315118A | 1998-12-02 | |||
| JPH10315131A | 1998-12-02 | |||
| JPH10217102A | 1998-08-18 | |||
| JPH11320376A | 1999-11-24 | |||
| JPH1058313A | 1998-03-03 | |||
| JPH0852652A | 1996-02-27 | |||
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Foreign References:
| US5833519A | 1998-11-10 | |||
| US5456627A | 1995-10-10 | |||
| US5975994A | 1999-11-02 |
Attorney, Agent or Firm:
Shusaku Yamamoto