Title:
【発明の名称】半導体基板内に垂直な中空針を形成する方法
Document Type and Number:
Japanese Patent JP2003519014
Kind Code:
A
Abstract:
A method of forming a needle includes the step of anisotropically etching a channel into the back side of a semiconductor substrate. The front side of the semiconductor substrate is then isotropically etched to form a vertical axial surface surrounding the channel. The resultant needle has an elongated body formed of a semiconductor material. The elongated body includes an axial surface positioned between a first end and a second end. The axial surface defines a channel between the first end and the second end. In one embodiment, the first end has a sloping tip with a single circumferential termination point.
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Inventors:
Stover, Boris
Leapman, Durian
Leapman, Durian
Application Number:
JP2001549726A
Publication Date:
June 17, 2003
Filing Date:
January 02, 2001
Export Citation:
Assignee:
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
International Classes:
B81C1/00; A61M5/158; A61M5/32; A61M37/00; B81B1/00; H01L21/66; (IPC1-7): B81C1/00; A61M5/158; A61M37/00; B81B1/00; H01L21/66
Attorney, Agent or Firm:
Yuzo Yamazaki (2 outside)