Title:
【発明の名称】コンデンサが集積された電子パッケージ
Document Type and Number:
Japanese Patent JP2003521119
Kind Code:
A
Abstract:
Generally provided is a circuit assembly construction for controlling impedance in an electronic package. A large scale, parallel-plate capacitor includes two electrodes separated by a dielectric material. The electrodes serve as reference voltage planes for the electronic package. At least one of the electrodes is patterned such that both electrodes are accessible from a common side of the capacitor. The capacitor is positioned with a first electrode mounted adjacent to an interconnect circuit portion of the electronic package. An electronic device portion of the electronic package is electrically connected, directly or indirectly, to one or more of the electrodes of the capacitor.
More Like This:
Inventors:
John Di Geisinger
Paul M Harvey
Robert Earl Kushku
Paul M Harvey
Robert Earl Kushku
Application Number:
JP2001555112A
Publication Date:
July 08, 2003
Filing Date:
May 25, 2000
Export Citation:
Assignee:
3M Innovative Properties Company
International Classes:
H01L23/12; H01L23/498; H01L23/50; H01L23/64; (IPC1-7): H01L23/12
Domestic Patent References:
| JPH09148746A | 1997-06-06 | |||
| JPH1126943A | 1999-01-29 |
Attorney, Agent or Firm:
Aoyama Ryo (2 outside people)