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Title:
【発明の名称】重合体分解から得られる低誘電性ナノ多孔性材料
Document Type and Number:
Japanese Patent JP2003529202
Kind Code:
A
Abstract:
The present invention relates to novel low dielectric constant nanoporous dielectric films having improved mechanical strength, and to improved processes for producing the same on substrates suitable for use in the production of integrated circuits. The nanoporous dielectric films are prepared by a process of preparing a mixture of a spin-on-glass material with a suitable thermally degradable polymer in a compatible solvent or solvents. Applying the resulting mixture onto a substrate suitable for use in the production of an integrated circuit, to produce a coated substrate. The coated substrate is then heated for a time and at one or more temperatures effective to remove the thermally degradable polymer, so as to produce the desired low dielectric nanoporous dielectric film. Semiconductors, such as integrated circuits with films according to the invention, are also provided.

Inventors:
Case, Suzanne
Lun, Roger You-Kan
Application Number:
JP2000612742A
Publication Date:
September 30, 2003
Filing Date:
April 14, 2000
Export Citation:
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Assignee:
Allied Signal, Inc.
International Classes:
C08J5/18; C01B33/113; C08L29/14; C08L33/12; C08L67/04; C08L71/02; C08L83/05; C09D183/04; H01L21/312; H01L21/316; H01L21/768; H01L23/522; (IPC1-7): H01L21/312; C01B33/113; C08J5/18; C08L29/14; C08L33/12; C08L67/04; C08L71/02; C08L83/05; H01L21/768
Domestic Patent References:
JPH1025359A1998-01-27
JP2000077399A2000-03-14
JPH0999056A1997-04-15
Attorney, Agent or Firm:
Kazuo Shamoto (5 outside)