Title:
【発明の名称】モジュールカード及びその製造方法
Document Type and Number:
Japanese Patent JP2003531033
Kind Code:
A
Abstract:
A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.
Inventors:
Joe Liu
Shu Wen Chu
Quofen Feng
Went Chuan Chen
Monnan Ho
Yang Shen Chu
Alice Chen
Nai Yeah
Shu Wen Chu
Quofen Feng
Went Chuan Chen
Monnan Ho
Yang Shen Chu
Alice Chen
Nai Yeah
Application Number:
JP2001577598A
Publication Date:
October 21, 2003
Filing Date:
December 04, 2000
Export Citation:
Assignee:
Sen Kai Science and Technology Hun Co., Ltd.
International Classes:
B42D15/10; H01L21/56; H01L23/498; (IPC1-7): B42D15/10; H01L21/56
Attorney, Agent or Firm:
Matsumoto Takemoto (5 outside)