Title:
【発明の名称】無接点接続システム
Document Type and Number:
Japanese Patent JP2003531496
Kind Code:
A
Abstract:
A contactless interconnecting system is provided between a computer chip package and a circuit board. The chip package has a substantially planar lower surface with a pattern of discrete terminal lands. The circuit board has a substantially planar upper surface spaced from and generally parallel to the lower surface of the chip package. A pattern of discrete circuit pads on the upper surface are aligned with the terminal lands. A plurality of discrete interposer members are disposed between the terminal lands and the circuit pads and are in a pattern corresponding to and aligned with the aligned patterns of the terminal lands and circuit pads. The interposer members are preferably of a material having a higher dielectric constant that of the material filling the gaps between interposer members.
Inventors:
August Peanella
Application Number:
JP2001577610A
Publication Date:
October 21, 2003
Filing Date:
April 12, 2001
Export Citation:
Assignee:
Molex Incorporated
International Classes:
H01L23/12; H01L23/48; H05K1/18; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Toshiaki Aoki (1 outside)