Title:
発光ダイオードチップおよびその製造方法
Document Type and Number:
Japanese Patent JP2004501507
Kind Code:
A
Abstract:
The invention concerns a light-emitting diode chip ( 1 ) comprising a radiation-emitting active region ( 32 ) and a window layer ( 2 ). To increase the luminous efficiency, the cross-sectional area of the radiation-emitting active region ( 32 ) is smaller than the cross-sectional area of the window layer ( 2 ) available for the decoupling of light. The invention is further directed to a method for fabricating a lens structure on the surface of a light-emitting component.
Inventors:
Georg Bogner
Sigmer kuogler
Gerald Neumann
Ernst Nilsl
Raimund Overschmidt
Karl-Heinz Schulelate
Olaf Schoenfeld
Norbert Stadt
Sigmer kuogler
Gerald Neumann
Ernst Nilsl
Raimund Overschmidt
Karl-Heinz Schulelate
Olaf Schoenfeld
Norbert Stadt
Application Number:
JP2001577616A
Publication Date:
January 15, 2004
Filing Date:
April 19, 2001
Export Citation:
Assignee:
Osram Opto Semikonductors GmbH
International Classes:
H01L33/02; H01L33/08; H01L33/20; H01L33/14; H01L33/44; (IPC1-7): H01L33/00
Domestic Patent References:
| JPS6386580A | 1988-04-16 |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel