Title:
マイクロ加工された流体装置およびその製造方法
Document Type and Number:
Japanese Patent JP2004505212
Kind Code:
A
Abstract:
The fluid-flow device ( 100 ) of the invention comprises a stack ( 30 ) covered by a closure wafer ( 20 ), said stack ( 30 ) comprising a support wafer ( 36 ), a layer of insulating material ( 34 ), and a silicon layer ( 32 ). The closure wafer ( 20 ) and/or said silicon layer ( 32 ) are machined so as to define a cavity ( 38 ) between said closure wafer ( 20 ) and said silicon layer ( 32 ), said support wafer ( 36 ) has at least one duct ( 102 ) passing right through it, said layer of insulating material ( 34 ) presenting at least one zone ( 35 ) that is entirely free of material placed at least in line with said duct ( 102 ) so as to co-operate with said cavity ( 38 ) to define a moving member ( 40 ) in said silicon layer ( 32 ), the moving member being suitable under the pressure of liquid in said cavity ( 38 ) for reversibly moving towards said support wafer ( 36 ) until contact is made between said moving member ( 40 ) and said support wafer ( 36 ).
Inventors:
Van Rintel, Harald Tea.
Melefer, Didier
Gunper, Stefan
Melefer, Didier
Gunper, Stefan
Application Number:
JP2001586745A
Publication Date:
February 19, 2004
Filing Date:
May 25, 2001
Export Citation:
Assignee:
Weston Bridge International Limited
International Classes:
G01L9/00; A61M1/00; A61M37/00; B81B3/00; B81C1/00; B81C3/00; F04B9/00; F04B43/02; F04B43/04; F16K15/14; (IPC1-7): F16K15/14; A61M1/00; A61M37/00; B81B3/00; B81C1/00; B81C3/00; F04B9/00; F04B43/02; F04B43/04; G01L9/00
Attorney, Agent or Firm:
Hidekazu Miyoshi
Yasuo Miyoshi
Yasuo Miyoshi