Title:
高導電性樹脂組成物を射出成形する方法およびこの方法のための装置
Document Type and Number:
Japanese Patent JP2004506538
Kind Code:
A
Abstract:
A technique and apparatus are disclosed for injection molding highly filled conductive resin compositions. These compositions include one or more of unsaturated polyester and vinyl ester resin; a copolymer having a terminal ethylene group; and at least about 50 weight percent of an inorganic particulate conductive filler, an initiator, and a rheological modifier to prevent phase separation between said resin and said conductive filler during molding. The method of the present invention allows these compositions to be molded into highly intricate and thin electrically and thermally conductive specimens without significant post process machining. The method involves the use of an injection molding apparatus that has a hopper with an auger having a vertical component in its positioning to feed into the feed throat of an injection molding machine which has a phenolic screw that has been modified to have a constant inner diameter and a constant flight depth.
Inventors:
Butler, Kurt Eye.
Thomas, Daniel G.
Thomas, Daniel G.
Application Number:
JP2002510249A
Publication Date:
March 04, 2004
Filing Date:
June 14, 2001
Export Citation:
Assignee:
Quantum Components, Inc.
International Classes:
B29C45/00; B29C45/18; C08F283/01; C08F290/06; C08F290/14; C08K3/04; C08L63/00; H01M8/02; B29K67/00; B29K105/16; B29K507/04; B29L31/34; H01M4/66; H01M8/24; (IPC1-7): B29C45/18; B29C45/00; C08F283/01; C08F290/06
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita