Title:
シーリングアセンブリ
Document Type and Number:
Japanese Patent JP2004507295
Kind Code:
A
Abstract:
A sealing assembly for attaching pliable tubes to rigid connecting members, for high pressure, low temperature service, which seals by compressing a sealing wafer around the pliable tubes. The pliable tubes pass through holes in the sealing wafer. As the wafer seal is axially compressed, the wafer seal is restrained against radial expansion, thereby exerting an inward radial pressure on the holes through the wafer seal to cause an hermetic seal between the wafer seal and the pliable tubes. A swage bushing can be used, with swage tubes that are swaged onto the pliable tubes by a swage clamp, for the purpose of axially restraining the pliable tubes.
Inventors:
Hayfield, John Frederick
Eric Lee
Eric Lee
Application Number:
JP2002521877A
Publication Date:
March 11, 2004
Filing Date:
July 31, 2001
Export Citation:
Assignee:
Cryogen Incorporated
International Classes:
A61B18/02; F16L39/02; (IPC1-7): A61B18/02; F16L39/02
Domestic Patent References:
| JPH07158780A | 1995-06-20 |
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Shinsuke Onuki
Tadashige Ito