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Patent Searching and Data


Title:
サブストレートの接合のための方法及び装置
Document Type and Number:
Japanese Patent JP2004516941
Kind Code:
A
Abstract:
A method and apparatus for joining at least two substrates together, especially to form an optical data carrier, are provided. Substrates are disposed in a spaced-apart manner between two plates that are disposed opposite from, and are movable relative to, one another. At least one of the plates is connected to a flexible membrane. At least the plate to which the flexible membrane is connected is moved in such a way that a pressure difference is produced on opposite sides of the membrane.

Inventors:
Ulrich Speer
Stephan Leonhard
Application Number:
JP2002554490A
Publication Date:
June 10, 2004
Filing Date:
December 13, 2001
Export Citation:
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Assignee:
STEAG HamaTech AG
International Classes:
B30B5/02; B29C43/20; B29C43/36; B29C43/56; B29C65/00; B30B1/00; G11B7/26; B29C65/48; (IPC1-7): B30B5/02
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel