Title:
研磨装置および研磨方法
Document Type and Number:
Japanese Patent JP2004526585
Kind Code:
A
Abstract:
A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing mechanism for pressing, against the first polishing surface, the surface of the substrate which has been brought into contact with the first polishing surface by the substrate carrier, a retainer ring mounted on the substrate carrier so as to surround the substrate which has been pressed against the first polishing surface by the pressing mechanism, and a retainer-ring-position-adjustment mechanism for adjustably positioning the retainer ring relative to the substrate, which has been pressed against the first polishing surface, in directions toward and away from the first polishing surface.
Inventors:
Tetsuji Togawa
Application Number:
JP2002593103A
Publication Date:
September 02, 2004
Filing Date:
May 29, 2002
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/04; B24B37/30; B24B37/32; H01L21/304; H01L21/321; (IPC1-7): B24B37/04; H01L21/304
Attorney, Agent or Firm:
Kazuo Shamoto
Akio Chiba
Osamu Hoshino
Fujihiro Kanda
Hiroyuki Uchida
Toru Miyamae
Akio Chiba
Osamu Hoshino
Fujihiro Kanda
Hiroyuki Uchida
Toru Miyamae