Title:
セラミックを処理するための装置及び方法
Document Type and Number:
Japanese Patent JP2004526649
Kind Code:
A
Abstract:
Apparatus and a method for processing a ceramic material includes placing the ceramic material in a microwave heating apparatus having a microwave cavity; subjecting the ceramic material to a combination of microwave radiation and conventional heat; and controlling the uniformity of the processing of the ceramic material so as to avoid deformations and cracking by applying the microwave radiation to the ceramic material through at least one branched slotted waveguide which substantially uniformly distributes the microwave radiation throughout the microwave cavity.
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Inventors:
Araya, Carlos Earl
Iskander, Magdie F
Elizabeth M, Willeno
Iskander, Magdie F
Elizabeth M, Willeno
Application Number:
JP2002555586A
Publication Date:
September 02, 2004
Filing Date:
December 20, 2001
Export Citation:
Assignee:
CORNING INCORPORATED
International Classes:
H05B6/70; C04B35/64; F27B17/00; F27D19/00; F27D21/00; F27D99/00; H05B6/72; H05B6/74; H05B6/80; (IPC1-7): C04B35/64; H05B6/70; H05B6/72; H05B6/74
Domestic Patent References:
| JPH0849983A | 1996-02-20 | |||
| JPH08171986A | 1996-07-02 | |||
| JPH09501539A | 1997-02-10 | |||
| JPS61216296A | 1986-09-25 | |||
| JPS5595292A | 1980-07-19 | |||
| JPH01168993U | 1989-11-29 |
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma
Go Sakuma