Title:
銅-酸化物のダマシン構造の化学機械研磨方法
Document Type and Number:
Japanese Patent JP2004532510
Kind Code:
A
Abstract:
A method of chemical mechanical polishing of a metal damascene structure which includes an insulation layer having trenches on a wafer and a metal layer having a lower portion located in trenches of the insulation layer and an upper portion overlying the lower portion and the insulation layer is provided. The method comprises a first step of planarizing the upper portion of the metal layer and a second step of polishing the insulation layer and the lower portion of the metal layer. In the first step of planarizing the upper portion of the metal layer, the wafer and a polishing pad is urged at an applied pressure p and a relative velocity v in a contact mode between the wafer and the polishing pad to promote an increased metal removal rate. In the second, the insulation layer and the lower portion of the metal layer are polished in a steady-state mode to form individual metal lines in the trenches with minimal dishing of the metal lines and overpolishing of the insulation layer.
More Like This:
Inventors:
Sana naji
Raijin-You
Oh Hilario El
Raijin-You
Oh Hilario El
Application Number:
JP2002560175A
Publication Date:
October 21, 2004
Filing Date:
January 23, 2002
Export Citation:
Assignee:
AMS MULS Inc.
International Classes:
B24B37/04; B24B49/16; H01L21/304; H01L21/3205; H01L21/321; (IPC1-7): H01L21/304; B24B37/00; B24B37/04; H01L21/3205
Attorney, Agent or Firm:
Minoru Nakamura
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda