Title:
マルチポート研磨用流体給付システム
Document Type and Number:
Japanese Patent JP2004536717
Kind Code:
A
Abstract:
A method and system for delivering a polishing fluid to a chemical mechanical polishing surface (104) is provided. In one embodiment, the system includes an arm (104) having a delivery portion disposed at least partially over the polishing surface. A first nozzle and a second nozzle are disposed on the delivery portion of the arm. The first nozzle (132) is adapted to flow the polishing fluid at a first rate while the second nozzle is adapted to flow the polishing fluid at a second rate that is different than the first rate. A method for delivering a polishing fluid to a chemical mechanical polishing surface generally includes the steps of supplying the polishing fluid to a semiconductor polishing surface in one location at a first rate and providing the polishing fluid to the polishing surface at a second location at a second rate which is different than the first rate.
Inventors:
Withers, Blandley, S.
Meng, Brenda, Earl.
Veline, lydia
Scarperos, Peter, N.
Downham, Brian, Jay.
Williams, Patrick
Ko, Terry, Kin Tin
Lee, Christopher, Hyunkyun
Reynold, Kenneth, Reese
Hiyane, John
Hanoi, daniel
Meng, Brenda, Earl.
Veline, lydia
Scarperos, Peter, N.
Downham, Brian, Jay.
Williams, Patrick
Ko, Terry, Kin Tin
Lee, Christopher, Hyunkyun
Reynold, Kenneth, Reese
Hiyane, John
Hanoi, daniel
Application Number:
JP2003516743A
Publication Date:
December 09, 2004
Filing Date:
August 02, 2002
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
B24B37/04; B24B57/02; H01L21/304; (IPC1-7): B24B37/00; B24B57/02; H01L21/304
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Yasuhito Suzuki
Yuichi Yamada
Yasuhito Suzuki