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Title:
双峰性ポリエチレン組成物及び該組成物から製造される製品
Document Type and Number:
Japanese Patent JP2005500423
Kind Code:
A
Abstract:
The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than −20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.

Inventors:
Van Dun, Joseph, Jay.
Schouterden, Patrick, Jay.
Sehanovish, Kalyan
Van den Bergen, Peter, F., M.
Jiblaj, Nulara
Van Vourden, Joan
Dixito, Ravi, Es.
Nikaji, Rudy
Gemoz, Frederik, Yi.
Application Number:
JP2003521716A
Publication Date:
January 06, 2005
Filing Date:
August 16, 2002
Export Citation:
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Assignee:
Dow Global Technologies Incorporated
International Classes:
C08F10/00; C08L23/04; C08F10/02; C08F210/16; C08L23/06; C08L23/08; C08F4/659; C08F110/02; (IPC1-7): C08L23/04; C08F10/02
Domestic Patent References:
JP2000109521A2000-04-18
JP2002528586A2002-09-03
JPH11106574A1999-04-20
JPH11199719A1999-07-27
Foreign References:
WO2000022040A12000-04-20
WO1997020868A11997-06-12
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Junko Kobayashi
Norio Omori