Title:
双峰性ポリエチレン組成物及び該組成物から製造される製品
Document Type and Number:
Japanese Patent JP2005500423
Kind Code:
A
Abstract:
The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than −20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.
Inventors:
Van Dun, Joseph, Jay.
Schouterden, Patrick, Jay.
Sehanovish, Kalyan
Van den Bergen, Peter, F., M.
Jiblaj, Nulara
Van Vourden, Joan
Dixito, Ravi, Es.
Nikaji, Rudy
Gemoz, Frederik, Yi.
Schouterden, Patrick, Jay.
Sehanovish, Kalyan
Van den Bergen, Peter, F., M.
Jiblaj, Nulara
Van Vourden, Joan
Dixito, Ravi, Es.
Nikaji, Rudy
Gemoz, Frederik, Yi.
Application Number:
JP2003521716A
Publication Date:
January 06, 2005
Filing Date:
August 16, 2002
Export Citation:
Assignee:
Dow Global Technologies Incorporated
International Classes:
C08F10/00; C08L23/04; C08F10/02; C08F210/16; C08L23/06; C08L23/08; C08F4/659; C08F110/02; (IPC1-7): C08L23/04; C08F10/02
Domestic Patent References:
JP2000109521A | 2000-04-18 | |||
JP2002528586A | 2002-09-03 | |||
JPH11106574A | 1999-04-20 | |||
JPH11199719A | 1999-07-27 |
Foreign References:
WO2000022040A1 | 2000-04-20 | |||
WO1997020868A1 | 1997-06-12 |
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Junko Kobayashi
Norio Omori
Eiji Katayama
Junko Kobayashi
Norio Omori