Title:
照射硬化性組成物および光学要素の組み立ておよび修復のための関連する方法ならびにそれによって製造される製品
Document Type and Number:
Japanese Patent JP2005509053
Kind Code:
A
Abstract:
Improved radiation-curable compositions and related methods useful in the assembly of optical components. These compositions cure via free-radical polymerization and comprise: about 30 to about 70 wt. % oligomer; about 10 to about 50 wt. % reactive diluent; and about 0.1 to about 40 wt. % adhesion promoter, wherein the cured composition exhibits a modulus of less than about 50 MPa, and a dry adhesion in excess of about 50 g force. A related aspect of the present invention is a higher modulus composition that cures via free-radical polymerization and comprises: about 30 to about 70 wt. % oligomer; about 10 to about 50 wt. % reactive diluent; and about 0.1 to about 40 wt. % polymerizable adhesion promoter, wherein the cured composition exhibits a modulus of greater than about 600 MPa.
Inventors:
Klongaus, Vadim, Valerivic
Montgomery, Eva, Irene
Dake, Kennes
Montgomery, Eva, Irene
Dake, Kennes
Application Number:
JP2003540264A
Publication Date:
April 07, 2005
Filing Date:
October 07, 2002
Export Citation:
Assignee:
DSM IP ASSETS B.V.
International Classes:
G02B6/44; C03C25/10; C03C27/10; C08F290/06; C08G18/67; C09D4/00; C09D4/06; C09D175/16; C09J4/00; C09J175/16; (IPC1-7): C09J4/00; G02B6/44
Attorney, Agent or Firm:
Mitsuo Matsui