Title:
ダイヤモンド工具用切削チップ及びダイヤモンド工具
Document Type and Number:
Japanese Patent JP2005516781
Kind Code:
A
Abstract:
A cutting tip for a diamond tool and a diamond tool having the same which serve to cut or perforate various brittle materials such as stone, brick, concrete and asphalt. In particular, the cutting tip for a diamond tool and the diamond tool have diamond particles which are suitably arrayed to improve the cutting rate. A cutting tip for a diamond tool having diamond particles which are distributed in the cutting tip, wherein the diamond particles are inclined in respect to a cutting direction in a plane parallel to a cutting surface, and arrayed whereby grooved channels are formed successively overlapped on a brittle substance in cutting operation.
Inventors:
Kim, souk wang
Kim, Jung-ho
Park, hi-dong
Kim, Jung-ho
Park, hi-dong
Application Number:
JP2003565686A
Publication Date:
June 09, 2005
Filing Date:
February 07, 2003
Export Citation:
Assignee:
Awa Diamond Industrial Company Limited
General Tall Corporation
General Tall Corporation
International Classes:
B23D61/18; B23P5/00; B24D3/06; B24D5/06; B24D3/00; B24D5/12; B28D1/04; B28D1/12; (IPC1-7): B24D3/00; B24D3/06; B24D5/06
Attorney, Agent or Firm:
Masaaki Kobayashi