Title:
プラグ接続可能な電子モジュール及びヒートシンク付きリセプタクル
Document Type and Number:
Japanese Patent JP2005520296
Kind Code:
A
Abstract:
A receptacle assembly includes a guide frame having a front end with an opening to an interior cavity of the guide frame. The front end is configured to receive a module assembly; and an EMI gasket is secured to an edge of the opening. The EMI gasket includes at least one conductive strap extending along a length of the edge, and the conductive strap covers a substantial majority of the edge to form a shielded EMI interface along the edge. A continuous conductive collar is provided on peripheral edges surrounding the opening. The collar is configured to form an uninterrupted and continuous EMI shielding interface with a gasket secured to a bezel. A bail ion the module may be used to cause actuators on the module to move and to press guide frame latches to a release position.
Inventors:
Bright, Edward, John
Costello, Bryan, Patrick
Schiffler, James, Charles
Stahl, Daniel, Eugene
Costello, Bryan, Patrick
Schiffler, James, Charles
Stahl, Daniel, Eugene
Application Number:
JP2003575687A
Publication Date:
July 07, 2005
Filing Date:
March 05, 2003
Export Citation:
Assignee:
Tyco Electronics Corporation
International Classes:
H01R13/635; G02B6/42; H01R13/62; H01R13/658; H01R24/00; H05K7/10; H05K7/20; H05K9/00; (IPC1-7): H01R24/00
Attorney, Agent or Firm:
Tyco Electronics Amplifier Co., Ltd.