Title:
高い拡散率の浸透剤を用いての膜の性能を向上させるプロセス
Document Type and Number:
Japanese Patent JP2005521556
Kind Code:
A
Abstract:
A method of reducing undesired topographic features, increasing film density, and/or increasing adhesion to an underlying substrate in a polymer film formed on a microelectronic substrate, comprises: (a) providing a microelectronic substrate, the substrate having a polymer film deposited thereon; (b) contacting the substrate to carbon dioxide (optionally containing additional ingredients such as cosolvents or chemical intermediates); and (c) elevating the pressure of the carbon dioxide to plasticize the polymer film and reduce undesired topographic features, increase film density, and/or increase adhesion of the film to the underlying substrate.
Inventors:
Carbonell, Reuben
De Simone, Joseph Em
McBrain, James Bee
DeYoung, James Pee
De Simone, Joseph Em
McBrain, James Bee
DeYoung, James Pee
Application Number:
JP2003581910A
Publication Date:
July 21, 2005
Filing Date:
March 26, 2003
Export Citation:
Assignee:
Meissel Technologies, Inc.
International Classes:
B05D1/40; B05D3/04; G03F7/16; G03F7/26; G03F7/38; H01L21/027; H01L21/3105; (IPC1-7): B05D3/04; B05D1/40; G03F7/38; H01L21/027
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Arihara Koichi
Matsushima Tetsuo