Title:
高精度造形フィラメント
Document Type and Number:
Japanese Patent JP2005523391
Kind Code:
A
Abstract:
Disclosed is a modeling filament for use as feedstock in a fused deposition modeling liquifier, and a method for manufacturing the filament. The diameter and standard deviation of the filament are controlled to meet various tolerance requirements of jam resistance, slip resistance, model strength, liquifier overflow prevention and hysteresis-free transient response. Standard deviation of the filament diameter is matched to a filament target diameter. The resulting filament is used to form high-quality models.
Inventors:
Com, James W.
Preedman, William Earl. Jr.
Levit, Paul Jay.
Scubic, Robert El.
Bat Cerder, John Samuel
Preedman, William Earl. Jr.
Levit, Paul Jay.
Scubic, Robert El.
Bat Cerder, John Samuel
Application Number:
JP2003586406A
Publication Date:
August 04, 2005
Filing Date:
April 17, 2003
Export Citation:
Assignee:
Stratasys, Inc.
International Classes:
B29C48/92; B29C48/05; B29C48/625; B29C67/00; D01F6/00; D02J1/22; B29K105/08; (IPC1-7): D01F6/00; B29C47/92
Domestic Patent References:
| JPH03158228A | 1991-07-08 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita