Title:
熱的インターコネクトおよびインターフェースシステム、製造方法およびその使用
Document Type and Number:
Japanese Patent JP2005538535
Kind Code:
A
Abstract:
Layered thermal components described herein include at least one thermal interface component and at least one heat spreader component coupled to the thermal interface component. A method of forming layered thermal components disclosed herein comprises: a) providing at least one thermal interface component; b) providing at least one heat spreader component; and c) physically coupling the at least one thermal interface component and the at least one heat spreader component. At least one additional layer, including a substrate layer, can be coupled to the layered thermal component. A method for forming the thermal interface components disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the thermal interface component A suitable interface material can also be produced that comprises at least one solder material. Additionally, a suitable interface material can be produced that comprises at least one solder material and at least one resin component.
Inventors:
Dane, Nancy
Noor, Paula
Robert Townsend
Nguyen, Mii
Eddie, Colin
Karan, Dan
Noor, Paula
Robert Townsend
Nguyen, Mii
Eddie, Colin
Karan, Dan
Application Number:
JP2004521992A
Publication Date:
December 15, 2005
Filing Date:
July 15, 2003
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
H01L23/373; (IPC1-7): H01L23/373
Attorney, Agent or Firm:
Yoshio Kawaguchi
Makoto Ono
Katsuma Osaki
Mitsuaki Tsubokura
Makoto Ono
Katsuma Osaki
Mitsuaki Tsubokura