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Title:
加熱蓋体を備えた熱処理ステーション
Document Type and Number:
Japanese Patent JP2005538564
Kind Code:
A
Abstract:
Methods and apparatuses to improve the temperature uniformity of a workpiece being processed on a heated platen of a thermal processing station. A heated platen is enclosed in a housing incorporating an additional heat source that uniformly outputs thermal energy into the process chamber in which the heated platen is positioned. In preferred embodiments, this heat source is positioned in the lid of the housing. It is additionally preferred that the heated lid includes features that provide a gas flow path to introduce to and/or purge gas from the process chamber. In terms of photoresist performance, the improved thermal uniformity provided by using such an additional heat source in the housing, e.g., in the lid, offers improved line width control and line uniformity across a wafer.

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Inventors:
Buon P. Nguyen
Richard E. Sims
Xiaogang Chu
Application Number:
JP2004535994A
Publication Date:
December 15, 2005
Filing Date:
August 01, 2003
Export Citation:
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Assignee:
FSI International Inc.
International Classes:
H05B3/68; C23C16/00; F27B17/00; F27D1/18; H01L21/00; H01L21/027; H01L; (IPC1-7): H01L21/027; H05B3/68
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Mitsuo Tateishi
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura
Tsutomu Kato
Yusuke Murakoshi
Tomoaki Komiya