Title:
熱軟化熱伝導性組成物およびその調製方法
Document Type and Number:
Japanese Patent JP2006503166
Kind Code:
A
Abstract:
A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature.
Inventors:
Drab edur bugwager
Application Number:
JP2004546727A
Publication Date:
January 26, 2006
Filing Date:
September 08, 2003
Export Citation:
Assignee:
DOW CORNING CORPORATION
International Classes:
C08L83/04; C08K3/00; C08K3/04; C08K3/08; C08L83/02; C09D5/25; C09K5/08; H01C1/084; H01L23/36; H01L23/373; C08K5/09
Domestic Patent References:
| JPS5580461A | 1980-06-17 | |||
| JP2004533515A | 2004-11-04 | |||
| JPH01215855A | 1989-08-29 | |||
| JPH09302231A | 1997-11-25 | |||
| JP2000327917A | 2000-11-28 |
Foreign References:
| WO2002092693A1 | 2002-11-21 | |||
| WO2002072702A1 | 2002-09-19 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro