Title:
電解研磨のためのシステムと方法
Document Type and Number:
Japanese Patent JP2006505697
Kind Code:
A
Abstract:
The present invention provides a process for electropolishing a conductive surface of a semiconductor wafer. During the process, a contact electrode in a contact solution contacts a contact region on surface of the conductive layer with the contact solution. Further, during the process a process electrode in a process solution contacts a process region on the conductive surface with the process solution while applying an electrical potential between the contact electrode and the process electrode to electropolish the surface of the conductive layer of the process region.
Inventors:
Tarlier, Homayoung
Basol, Brent M.
Basol, Brent M.
Application Number:
JP2005506666A
Publication Date:
February 16, 2006
Filing Date:
November 06, 2003
Export Citation:
Assignee:
Yes M Natur Inc.
International Classes:
C25F3/00; B23H5/08; B24B37/20; C25D5/02; C25D5/06; C25D5/22; C25D7/12; C25F3/02; C25F3/12; C25F3/30; C25F7/00; H01L21/00; H01L21/288; H01L21/3205; H01L21/321
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Ryo Hashimoto
Tetsuya Kazama
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Ryo Hashimoto
Tetsuya Kazama