Title:
改良された銀メッキ方法及びその方法により形成された物品
Document Type and Number:
Japanese Patent JP2006514713
Kind Code:
A
Abstract:
An improved method for plating an organic substrate with silver is disclosed. Improved plating is achieved in part through the use of Na4EDTA, which facilitates improved grain formation and recovery of silver from waste material. Articles prepared using the method of the invention are also disclosed.
Inventors:
Chandra, Satish N.
Naike, Vinesh
Naike, Vinesh
Application Number:
JP2004537944A
Publication Date:
May 11, 2006
Filing Date:
September 19, 2003
Export Citation:
Assignee:
Noble Fiber Technologies, Inc.
International Classes:
C23C20/04; C23C18/16; C23C18/18; C23C18/20; C23C18/44; D06M11/83
Attorney, Agent or Firm:
Mamoru Ushiki
Shimizu Sakaematsu
Kuniaki Toyama
Masayoshi Yoshida
Shimizu Sakaematsu
Kuniaki Toyama
Masayoshi Yoshida