Title:
局所的なウェーハの温度調節によるウェーハ全体における微細寸法のばらつき補正
Document Type and Number:
Japanese Patent JP2006519497
Kind Code:
A
Abstract:
A wafer etching system has a measuring device, an etching chamber, and a controller. The measuring device measures the critical dimension test feature (CD) along the profile of the wafer at a number of preset locations. The etching chamber receives the wafer from the measuring device. The etching chamber includes a chuck supporting the wafer and a number of heating elements disposed within the chuck. Each heating element is positioned adjacent to one of the preset locations on the wafer. The controller is coupled to the measuring device to receive the actual measured CD's for a particular wafer. The controller is also coupled to control the heating elements. The controller adjusts the temperature of the heating elements during a process to reduce so as the variation of critical dimensions measured at the preset locations.
Inventors:
Robert Jay Steger
Application Number:
JP2006503525A
Publication Date:
August 24, 2006
Filing Date:
February 12, 2004
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
H01L21/3065; F27B5/14; F27B17/00; F27D19/00; F27D21/00; F27D99/00; H01J37/32; H01L21/00; H01L21/306; H01L
Domestic Patent References:
| JP2003017471A | 2003-01-17 | |||
| JP2002076103A | 2002-03-15 | |||
| JPH1098023A | 1998-04-14 | |||
| JPH07201822A | 1995-08-04 | |||
| JPH1154482A | 1999-02-26 | |||
| JP2003512519A | 2003-04-02 | |||
| JPH0845909A | 1996-02-16 |
Foreign References:
| EP1079428A2 | 2001-02-28 |
Attorney, Agent or Firm:
Masayuki Masabayashi