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Patent Searching and Data


Title:
真空を維持するための微結晶粒ゲッタ層を有するマイクロデバイス組立体
Document Type and Number:
Japanese Patent JP2006521688
Kind Code:
A
Abstract:
A microdevice assembly (20) that includes a device microstructure (22), a housing (30), and a fine grain getter layer (40). The housing (30) has a base portion (32) and a lid (34). The device microstructure (22) is attached to the base portion (32) and the lid (34) is hermetically sealed to the base portion (32). The housing (30) defines a cavity (38) surrounding the device microstructure (22). The fine grain getter layer (40) is on an interior side (42) of the lid (34) for maintaining a vacuum in the cavity (38) surrounding the device microstructure (22). The lid (34) may be made of metal or have at least a metallic surface in the region where the fine grain getter layer (40) is applied. The fine grain getter layer (40) has a sub-micron grain size. There is also a method for making the microdevice assembly (20).

Inventors:
One, Joe Pee.
Field, Sheryl Bee.
Pfeiffer, Michael
Application Number:
JP2005518872A
Publication Date:
September 21, 2006
Filing Date:
February 05, 2004
Export Citation:
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Assignee:
MOTOROLA INCORPORATED
International Classes:
H01L23/26; B81B1/00; B81B7/00; G01C19/56; G01P9/04; H01J9/38; H01J19/70; H01L29/84; B81B
Domestic Patent References:
JPH10163505A1998-06-19
Foreign References:
US5866978A1999-02-02
WO2003009317A22003-01-30
Attorney, Agent or Firm:
Mamoru Kuwagaki