Title:
多層有機積層体を用いて製造した集積受動素子
Document Type and Number:
Japanese Patent JP2006521775
Kind Code:
A
Abstract:
The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multilayer board, ceramic carrier or silicon platform in the form of an integrated passive device. The passive device includes side shielding on two sides in the SMD form and four sides in the BGA/CSP form. The side shielding can be external or in-built.
Inventors:
White, George E.
Swaminathan, Madhavan
Dalmere, Sydhaas
Sundalam, Venkatesh
Swaminathan, Madhavan
Dalmere, Sydhaas
Sundalam, Venkatesh
Application Number:
JP2006509404A
Publication Date:
September 21, 2006
Filing Date:
March 29, 2004
Export Citation:
Assignee:
Georgia Tech Research Corporation
International Classes:
H01P1/203; H01F41/04; H01L21/48; H01L25/065; H01L27/08; H03H7/38; H01F17/00
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Masakazu Ito