Title:
電子モジュールの製造方法及び電子モジュール
Document Type and Number:
Japanese Patent JP2006523375
Kind Code:
A
Abstract:
This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.
Inventors:
List Tuominen
Petteri Palm
Petteri Palm
Application Number:
JP2006505627A
Publication Date:
October 12, 2006
Filing Date:
March 31, 2004
Export Citation:
Assignee:
Imbella Electronics
International Classes:
H05K1/18; H01L21/60; H01L23/12; H01L23/538; H01L25/065; H01L25/07; H01L25/18; H05K3/46
Attorney, Agent or Firm:
Kosaku Sugimura
Kazuaki Takami
Hiroshi Tokunaga
Yoshiyuki Iwasa
Shiro Fujitani
Kiyoshi Kuruma
Kazuyuki Tomita
Kazuaki Takami
Hiroshi Tokunaga
Yoshiyuki Iwasa
Shiro Fujitani
Kiyoshi Kuruma
Kazuyuki Tomita