Title:
高速高密度の電気コネクタ及びコネクタアッセンブリ
Document Type and Number:
Japanese Patent JP2007516565
Kind Code:
A
Abstract:
In one embodiment of the invention, there is disclosed an electrical connector connectable to a printed circuit board on one end, which includes an insulative housing and a plurality of insulative posts disposed in the insulative housing, with the insulative posts arranged in at least one row. Each of the insulative posts has a first side and a second side, and the insulative posts extend in a direction away from the printed circuit board. A plurality of signal conductors are provided, with each signal conductor having a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion therebetween that is disposed in the insulative housing, wherein the signal conductors are disposed along the first side of the insulative posts. A plurality of ground conductors are provided, with each ground conductor having a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion therebetween that is disposed in the insulative housing, wherein the ground conductors are disposed along the second side of the insulative posts such that the signal conductors and the ground conductors are electrically isolated from one another.
Inventors:
Stoko, Philip Tea
Neil Jay, Bacon
Payne, Jason Jay
Neil Jay, Bacon
Payne, Jason Jay
Application Number:
JP2006517588A
Publication Date:
June 21, 2007
Filing Date:
June 23, 2004
Export Citation:
Assignee:
TERADYNE INCORPORATED
International Classes:
H01R12/16; H01R13/6586
Domestic Patent References:
| JP2004500684A | 2004-01-08 | |||
| JP2001307817A | 2001-11-02 | |||
| JPH097702A | 1997-01-10 | |||
| JP2002530840A | 2002-09-17 |
Attorney, Agent or Firm:
Kazuo Shamoto
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Tadashi Masui
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Tadashi Masui