Title:
圧縮及び/又は加圧発泡体、気泡、及び/又は液体を用いて半導体ウェーハを洗浄するための方法及び装置
Document Type and Number:
Japanese Patent JP2007517401
Kind Code:
A
Abstract:
An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer. such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer. is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.
Inventors:
Delarios John M
Lovekin Mike
Faber Jeffrey
Korlik Mikhail
Lidcar fritz
Orchards alexander
Lovekin Mike
Faber Jeffrey
Korlik Mikhail
Lidcar fritz
Orchards alexander
Application Number:
JP2006547238A
Publication Date:
June 28, 2007
Filing Date:
December 17, 2004
Export Citation:
Assignee:
Rum Research Corporation
International Classes:
H01L21/304; B08B3/00; H01L21/00; H01L21/306
Domestic Patent References:
| JPH06177101A | 1994-06-24 | |||
| JP2004349675A | 2004-12-09 |
Foreign References:
| US20020094684A1 | 2002-07-18 |
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda