Title:
マイクロ加工熱線真空センサ
Document Type and Number:
Japanese Patent JP2007522481
Kind Code:
A
Abstract:
A microfabricated vacuum sensor may be formed using semiconductor integrated circuit processes. The sensor may be formed inside an enclosure with a microfabricated component. The sensor may then be used to measure the pressure within the enclosure.
Inventors:
Elephant, Yurin, Lee
Heck, John
Alana, Leonel
Heck, John
Alana, Leonel
Application Number:
JP2006554353A
Publication Date:
August 09, 2007
Filing Date:
March 18, 2005
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
G01L21/12; G01L11/00; G01M3/18; G01M3/32; H05K5/00; H05K5/06
Domestic Patent References:
| JP2000074770A | 2000-03-14 | |||
| JP2001324403A | 2001-11-22 |
Attorney, Agent or Firm:
Akihiro Ryuka