Title:
一体型上側真空パッケージ
Document Type and Number:
Japanese Patent JP2007522648
Kind Code:
A
Abstract:
An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
Inventors:
Higashi, Robert Y
Jeffrey A. Ridley
Newstrom-Pezzo, Karen M
Jeffrey A. Ridley
Newstrom-Pezzo, Karen M
Application Number:
JP2006547182A
Publication Date:
August 09, 2007
Filing Date:
December 08, 2004
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
H01L23/02; G01J5/20; G02B5/28; H01L21/02; H01L27/00; H01L27/146; H01L31/0203; H01L31/0216
Domestic Patent References:
| JP2004521329A | 2004-07-15 | |||
| JPH11340348A | 1999-12-10 | |||
| JPH0982828A | 1997-03-28 | |||
| JP2006527481A | 2006-11-30 |
Attorney, Agent or Firm:
Kazuo Shamoto
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Yoshio Akimoto
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Yoshio Akimoto