Title:
合板および合板を製造するための方法
Document Type and Number:
Japanese Patent JP2007523764
Kind Code:
A
Abstract:
The invention relates to plywood, comprising at least two wood veneer layers and at least one adhesive layer, whereby the adhesive layer comprises a resin composition comprising a triazine compound (T), formaldehyde (F) and optionally urea, wherein the molar F/(NH2)2 ratio of the adhesive layer lies between 0.70 and 1.10 and the molar F/T ratio of the adhesive layer lies between 1.0 and 3.5. The invention further relates to a process for the preparation of plywood
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Inventors:
Evers, Lars
Mattei, Joseph, Maria, Johannes
Mattei, Joseph, Maria, Johannes
Application Number:
JP2006544298A
Publication Date:
August 23, 2007
Filing Date:
December 09, 2004
Export Citation:
Assignee:
DSM IP ASSETS B.V.
International Classes:
B27D1/04; B27D1/10; B32B7/12; B32B21/14; C08G12/32; C08G12/38; C09J161/24; C09J161/28; C09J161/32
Attorney, Agent or Firm:
Yuichi Yamada
Masakazu Noda
Yoshinori Shimizu
Masakazu Noda
Yoshinori Shimizu