Title:
ロール・ツー・ロールで製作された光学シートおよび封入された半導体回路デバイス
Document Type and Number:
Japanese Patent JP2007531321
Kind Code:
A
Abstract:
A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top transparent substrate is provided having a transparent conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the transparent conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate. Thus, the p and n sides of each LED die are automatically connected to the top conductive layer and the bottom conductive surface. Each LED die is encapsulated and secured between the substrates in the flexible, hotmelt adhesive sheet layer. The bottom substrate, the hotmelt adhesive (with the embedded LED die) and the top substrate can be provided as rolls of material. The rolls are brought together in a continuous roll fabrication process, resulting in a flexible sheet of lighting material.
Inventors:
Daniels John J.
Nelson Gregory Buoy
Nelson Gregory Buoy
Application Number:
JP2007506288A
Publication Date:
November 01, 2007
Filing Date:
March 26, 2005
Export Citation:
Assignee:
ARTICULATED TECHNOLOGIES, LLC
International Classes:
H01L33/48; H01L21/60; H01L25/04; H01L25/18; H01L33/44; H01L33/50; H01L33/54; H01L33/56; H01L33/60; H01L33/62; H05B33/00; H05B33/14; F21K99/00; H01L21/98; H01L25/075; H01L27/146
Domestic Patent References:
| JP2002512734A | 2002-04-23 | |||
| JPS6475294A | 1989-03-20 | |||
| JP2003030614A | 2003-01-31 |
Foreign References:
| WO2004009349A1 | 2004-01-29 | |||
| US20020096254A1 | 2002-07-25 | |||
| US5273608A | 1993-12-28 |
Attorney, Agent or Firm:
Yamato Tsutsui
Yoshitaka Kozuka
Akiko Tsutsui
Yoshitaka Kozuka
Akiko Tsutsui
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